Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics

We have used TEM and Hertzian indentation to study the interrelation between subsurface damage and residual stress introduced by grinding and diamond polishing surfaces of polycrystalline alumina and 5%SiC/alumina nanocomposites. In all cases a layer of high dislocation density was found near the su...

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Main Authors: Wu, H, Roberts, S, Derby, B
Format: Journal article
Language:English
Published: Elsevier 2001
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author Wu, H
Roberts, S
Derby, B
author_facet Wu, H
Roberts, S
Derby, B
author_sort Wu, H
collection OXFORD
description We have used TEM and Hertzian indentation to study the interrelation between subsurface damage and residual stress introduced by grinding and diamond polishing surfaces of polycrystalline alumina and 5%SiC/alumina nanocomposites. In all cases a layer of high dislocation density was found near the surface. This varied in thickness from about 300 nm for alumina polished with 1 μm diamond grit to greater than 6 μm for a nanocomposite surface wheel-ground with 150 μm diamond grit. For a given finishing process the nanocomposites showed a greater depth of dislocation activity than alumina. In alumina, extensive basal twinning was found beneath the ground surfaces. Hertzian indentation data indicates a residual compressive stress of about 1500 MPa confined to the dislocation-containing region. Mechanisms for the enhanced dislocation activity in the nanocomposites are discussed.
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spelling oxford-uuid:06c19f32-ddb0-4caa-adb1-bc87ddec93112022-03-26T09:04:07ZResidual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramicsJournal articlehttp://purl.org/coar/resource_type/c_dcae04bcuuid:06c19f32-ddb0-4caa-adb1-bc87ddec9311EnglishSymplectic Elements at OxfordElsevier2001Wu, HRoberts, SDerby, BWe have used TEM and Hertzian indentation to study the interrelation between subsurface damage and residual stress introduced by grinding and diamond polishing surfaces of polycrystalline alumina and 5%SiC/alumina nanocomposites. In all cases a layer of high dislocation density was found near the surface. This varied in thickness from about 300 nm for alumina polished with 1 μm diamond grit to greater than 6 μm for a nanocomposite surface wheel-ground with 150 μm diamond grit. For a given finishing process the nanocomposites showed a greater depth of dislocation activity than alumina. In alumina, extensive basal twinning was found beneath the ground surfaces. Hertzian indentation data indicates a residual compressive stress of about 1500 MPa confined to the dislocation-containing region. Mechanisms for the enhanced dislocation activity in the nanocomposites are discussed.
spellingShingle Wu, H
Roberts, S
Derby, B
Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
title Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
title_full Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
title_fullStr Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
title_full_unstemmed Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
title_short Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
title_sort residual stress and subsurface damage in machined alumina and alumina silicon carbide nanocomposite ceramics
work_keys_str_mv AT wuh residualstressandsubsurfacedamageinmachinedaluminaandaluminasiliconcarbidenanocompositeceramics
AT robertss residualstressandsubsurfacedamageinmachinedaluminaandaluminasiliconcarbidenanocompositeceramics
AT derbyb residualstressandsubsurfacedamageinmachinedaluminaandaluminasiliconcarbidenanocompositeceramics