Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
We have used TEM and Hertzian indentation to study the interrelation between subsurface damage and residual stress introduced by grinding and diamond polishing surfaces of polycrystalline alumina and 5%SiC/alumina nanocomposites. In all cases a layer of high dislocation density was found near the su...
Main Authors: | Wu, H, Roberts, S, Derby, B |
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פורמט: | Journal article |
שפה: | English |
יצא לאור: |
Elsevier
2001
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פריטים דומים
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Residual stress determination and subsurface microstructure in ground and polished alumina/silicon carbide nanocomposites and monolithic alumina ceramics
מאת: Wu, H, et al.
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Subsurface damage in alumina and alumina-silicon carbide nanocomposites
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Ductile deformation in alumina/silicon carbide nanocomposites
מאת: Wu, H, et al.
יצא לאור: (2010) -
Sub-surface damage in ground and annealed alumina and alumina-silicon carbide nanocomposites
מאת: Tanner, B, et al.
יצא לאור: (2006) -
Crack healing in an alumina/silicon carbide nanocomposite after grinding and annealing
מאת: Wu, H, et al.
יצא לאור: (2000)