Residual stress and subsurface damage in machined alumina and alumina/silicon carbide nanocomposite ceramics
We have used TEM and Hertzian indentation to study the interrelation between subsurface damage and residual stress introduced by grinding and diamond polishing surfaces of polycrystalline alumina and 5%SiC/alumina nanocomposites. In all cases a layer of high dislocation density was found near the su...
Үндсэн зохиолчид: | Wu, H, Roberts, S, Derby, B |
---|---|
Формат: | Journal article |
Хэл сонгох: | English |
Хэвлэсэн: |
Elsevier
2001
|
Ижил төстэй зүйлс
-
Residual stress determination and subsurface microstructure in ground and polished alumina/silicon carbide nanocomposites and monolithic alumina ceramics
-н: Wu, H, зэрэг
Хэвлэсэн: (2000) -
Subsurface damage in alumina and alumina-silicon carbide nanocomposites
-н: Tanner, B, зэрэг
Хэвлэсэн: (2004) -
Ductile deformation in alumina/silicon carbide nanocomposites
-н: Wu, H, зэрэг
Хэвлэсэн: (2010) -
Sub-surface damage in ground and annealed alumina and alumina-silicon carbide nanocomposites
-н: Tanner, B, зэрэг
Хэвлэсэн: (2006) -
Crack healing in an alumina/silicon carbide nanocomposite after grinding and annealing
-н: Wu, H, зэрэг
Хэвлэсэн: (2000)