Synchrotron tests of 3D Medipix2 and TimePix X-Ray Detectors

In this article we report on the use micro-focus synchrotron X-ray radiation and pion beams to compare the detection efficiencies and charge sharing properties of novel 3D detectors to that of the current planar technology. Detector substrates are bump-bonded to the Medipx2 and Timepix chips. 55μm s...

Full description

Bibliographic Details
Main Authors: Mac Raighne, A, Akiba, K, Alianelli, L, Artuso, M, Bates, R, Bayer, F, Buytaert, J, Collins, P, Crossley, M, Eklund, L, Fleta, C, Gallas, A, Gandelman, M, Gersabeck, M, Gimenez, E, Gligorov, V, Huse, T, John, M, Llin, L, Lozano, M, Maneuski, D, Marchal, J, Michel, T, Nicol, M, Pellegrini, G
Format: Journal article
Language:English
Published: 2009
Description
Summary:In this article we report on the use micro-focus synchrotron X-ray radiation and pion beams to compare the detection efficiencies and charge sharing properties of novel 3D detectors to that of the current planar technology. Detector substrates are bump-bonded to the Medipx2 and Timepix chips. 55μm square pixel maps of the detection efficiencies have been produced using X-ray and MIP beams. For X-rays, a drop of 3-4% detection efficiency over the pixel area was found due to the central electrode. The corner electrodes show no degradation in efficiency compared to that of the planar device. For MIPs a drop of 0.5% in efficiency due to the central electrode was observed. Evidence of a considerable reduction in charge sharing in the 3D detectors compared to the planar devices is also shown. ©2009 IEEE.