Mapping type III intragranular residual stress distributions in deformed copper polycrystals
Cross-correlation-based analysis of electron backscatter diffraction patterns has been used to map the intragranular residual stress variations in polycrystalline copper samples deformed to different plastic strain levels of 0%, 2%, 6% and 10%. We map the deviation from the mean stress within each g...
| Main Authors: | , , |
|---|---|
| Format: | Journal article |
| Published: |
2013
|
| _version_ | 1826266229272215552 |
|---|---|
| author | Jiang, J Britton, T Wilkinson, A |
| author_facet | Jiang, J Britton, T Wilkinson, A |
| author_sort | Jiang, J |
| collection | OXFORD |
| description | Cross-correlation-based analysis of electron backscatter diffraction patterns has been used to map the intragranular residual stress variations in polycrystalline copper samples deformed to different plastic strain levels of 0%, 2%, 6% and 10%. We map the deviation from the mean stress within each grain and present histograms of stress levels mapped over many grains which show a central Gaussian-like peak with non-Gaussian tails at the higher stress magnitudes. The width of the peaks increased with increasing plastic deformation and the tails became more obvious. Plots correlating maximum in-plane shear stress and distance to the nearest grain boundary demonstrate that stress "hot spots" tend to accumulate near grain boundaries. © 2013 Acta Materialia Inc. |
| first_indexed | 2024-03-06T20:35:44Z |
| format | Journal article |
| id | oxford-uuid:328f7e3f-9a0f-41a7-998f-db384f122c16 |
| institution | University of Oxford |
| last_indexed | 2024-03-06T20:35:44Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | oxford-uuid:328f7e3f-9a0f-41a7-998f-db384f122c162022-03-26T13:14:53ZMapping type III intragranular residual stress distributions in deformed copper polycrystalsJournal articlehttp://purl.org/coar/resource_type/c_dcae04bcuuid:328f7e3f-9a0f-41a7-998f-db384f122c16Symplectic Elements at Oxford2013Jiang, JBritton, TWilkinson, ACross-correlation-based analysis of electron backscatter diffraction patterns has been used to map the intragranular residual stress variations in polycrystalline copper samples deformed to different plastic strain levels of 0%, 2%, 6% and 10%. We map the deviation from the mean stress within each grain and present histograms of stress levels mapped over many grains which show a central Gaussian-like peak with non-Gaussian tails at the higher stress magnitudes. The width of the peaks increased with increasing plastic deformation and the tails became more obvious. Plots correlating maximum in-plane shear stress and distance to the nearest grain boundary demonstrate that stress "hot spots" tend to accumulate near grain boundaries. © 2013 Acta Materialia Inc. |
| spellingShingle | Jiang, J Britton, T Wilkinson, A Mapping type III intragranular residual stress distributions in deformed copper polycrystals |
| title | Mapping type III intragranular residual stress distributions in deformed copper polycrystals |
| title_full | Mapping type III intragranular residual stress distributions in deformed copper polycrystals |
| title_fullStr | Mapping type III intragranular residual stress distributions in deformed copper polycrystals |
| title_full_unstemmed | Mapping type III intragranular residual stress distributions in deformed copper polycrystals |
| title_short | Mapping type III intragranular residual stress distributions in deformed copper polycrystals |
| title_sort | mapping type iii intragranular residual stress distributions in deformed copper polycrystals |
| work_keys_str_mv | AT jiangj mappingtypeiiiintragranularresidualstressdistributionsindeformedcopperpolycrystals AT brittont mappingtypeiiiintragranularresidualstressdistributionsindeformedcopperpolycrystals AT wilkinsona mappingtypeiiiintragranularresidualstressdistributionsindeformedcopperpolycrystals |