Mapping type III intragranular residual stress distributions in deformed copper polycrystals
Cross-correlation-based analysis of electron backscatter diffraction patterns has been used to map the intragranular residual stress variations in polycrystalline copper samples deformed to different plastic strain levels of 0%, 2%, 6% and 10%. We map the deviation from the mean stress within each g...
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| Format: | Journal article |
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2013
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Mapping type III intragranular residual stress distributions in deformed copper polycrystals
Published 2013
Journal article