Microwave effects on the electrochemical deposition of copper
The effects of microwave radiation on the electro-deposition of copper metal on platinum, gold, and carbon electrode surfaces are studied by cyclic voltammetry and scanning electron microscopy. Electrochemical experiments under microwave conditions are carried out in a conventional three-electrode e...
Main Authors: | , , , |
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Format: | Journal article |
Language: | English |
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2004
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author | Sur, UK Marken, F Compton, R Coles, B |
author_facet | Sur, UK Marken, F Compton, R Coles, B |
author_sort | Sur, UK |
collection | OXFORD |
description | The effects of microwave radiation on the electro-deposition of copper metal on platinum, gold, and carbon electrode surfaces are studied by cyclic voltammetry and scanning electron microscopy. Electrochemical experiments under microwave conditions are carried out in a conventional three-electrode electrochemical cell placed into a 2.45 GHz microwave cavity. The microwave effect is associated with steady state electrode temperatures of up to 400 K and mass transport enhancements, which are both electrode size and electrode material dependent. The most dramatic mass transport effects are observed at 25 μm diameter platinum microelectrodes with limiting current increases of more than two orders of magnitude. The morphology of the copper deposit at 50 μm diameter platinum electrodes is shown to change from dendritic to cauliflower-type at high microwave intensities. In situ thermal de-complexation of Cu2+ cations in the presence of a strong complexing agent bovine serum albumin (BSA) is achieved under the microwave conditions. |
first_indexed | 2024-03-06T20:40:52Z |
format | Journal article |
id | oxford-uuid:343b4ab0-d0ce-44e4-98cf-89f01f0c86d7 |
institution | University of Oxford |
language | English |
last_indexed | 2024-03-06T20:40:52Z |
publishDate | 2004 |
record_format | dspace |
spelling | oxford-uuid:343b4ab0-d0ce-44e4-98cf-89f01f0c86d72022-03-26T13:24:43ZMicrowave effects on the electrochemical deposition of copperJournal articlehttp://purl.org/coar/resource_type/c_dcae04bcuuid:343b4ab0-d0ce-44e4-98cf-89f01f0c86d7EnglishSymplectic Elements at Oxford2004Sur, UKMarken, FCompton, RColes, BThe effects of microwave radiation on the electro-deposition of copper metal on platinum, gold, and carbon electrode surfaces are studied by cyclic voltammetry and scanning electron microscopy. Electrochemical experiments under microwave conditions are carried out in a conventional three-electrode electrochemical cell placed into a 2.45 GHz microwave cavity. The microwave effect is associated with steady state electrode temperatures of up to 400 K and mass transport enhancements, which are both electrode size and electrode material dependent. The most dramatic mass transport effects are observed at 25 μm diameter platinum microelectrodes with limiting current increases of more than two orders of magnitude. The morphology of the copper deposit at 50 μm diameter platinum electrodes is shown to change from dendritic to cauliflower-type at high microwave intensities. In situ thermal de-complexation of Cu2+ cations in the presence of a strong complexing agent bovine serum albumin (BSA) is achieved under the microwave conditions. |
spellingShingle | Sur, UK Marken, F Compton, R Coles, B Microwave effects on the electrochemical deposition of copper |
title | Microwave effects on the electrochemical deposition of copper |
title_full | Microwave effects on the electrochemical deposition of copper |
title_fullStr | Microwave effects on the electrochemical deposition of copper |
title_full_unstemmed | Microwave effects on the electrochemical deposition of copper |
title_short | Microwave effects on the electrochemical deposition of copper |
title_sort | microwave effects on the electrochemical deposition of copper |
work_keys_str_mv | AT suruk microwaveeffectsontheelectrochemicaldepositionofcopper AT markenf microwaveeffectsontheelectrochemicaldepositionofcopper AT comptonr microwaveeffectsontheelectrochemicaldepositionofcopper AT colesb microwaveeffectsontheelectrochemicaldepositionofcopper |