Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images...

詳細記述

書誌詳細
主要な著者: Song, X, Yeap, K, Zhu, J, Belnoue, J, Sebastiani, M, Bemporad, E, Zeng, K, Korsunsky, A
フォーマット: Journal article
言語:English
出版事項: 2012