Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging
Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images...
| Hauptverfasser: | , , , , , , , |
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| Format: | Journal article |
| Sprache: | English |
| Veröffentlicht: |
2012
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