Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Pokaż inne wersje (1)

Residual stress evaluation in thin films at the sub-micron scale was achieved in the present study using a semi-destructive trench-cutting (ring-core) method. Focused Ion Beam was employed to introduce the strain relief by milling the slots around an "island" and also to record the images...

Szczegółowa specyfikacja

Opis bibliograficzny
Główni autorzy:	Song, X, Yeap, K, Zhu, J, Belnoue, J, Sebastiani, M, Bemporad, E, Zeng, K, Korsunsky, A
Format:	Journal article
Język:	English
Wydane:	2012

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