Oxygen-dislocation interactions in silicon at temperatures below 700 degrees C: Dislocation locking and oxygen diffusion

The locking of dislocations by oxygen atoms in Czochralski-silicon at temperatures between 350 and 700°C has been studied. Both experimental and theoretical investigations were carried out for different oxygen concentrations, different annealing times (from 10 to 3 × 107 s), and different point defe...

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Príomhchruthaitheoirí: Senkader, S, Wilshaw, P, Falster, R
Formáid: Journal article
Teanga:English
Foilsithe / Cruthaithe: 2001