Oxygen-dislocation interactions in silicon at temperatures below 700 degrees C: Dislocation locking and oxygen diffusion

The locking of dislocations by oxygen atoms in Czochralski-silicon at temperatures between 350 and 700°C has been studied. Both experimental and theoretical investigations were carried out for different oxygen concentrations, different annealing times (from 10 to 3 × 107 s), and different point defe...

Повний опис

Бібліографічні деталі
Автори: Senkader, S, Wilshaw, P, Falster, R
Формат: Journal article
Мова:English
Опубліковано: 2001