Microstructural characterisation of spray formed Si-30Al for thermal management applications

This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ∼5 μm equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ∼10 μm equiaxed Al-rich grains interpenetra...

詳細記述

書誌詳細
主要な著者: Hogg, S, Lambourne, A, Ogilvy, A, Grant, P
フォーマット: Journal article
言語:English
出版事項: 2006