Microstructural characterisation of spray formed Si-30Al for thermal management applications
This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ∼5 μm equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ∼10 μm equiaxed Al-rich grains interpenetra...
主要な著者: | , , , |
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フォーマット: | Journal article |
言語: | English |
出版事項: |
2006
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