Inhomogeneous strain release during bending of WS2 on flexible substrates
Two-dimensional (2D) materials hold great promise in flexible electronics, but the weak van der Waals interlayer bonding may pose a problem during bending, where easy interlayer sliding can occur. Furthermore, thin films of rigid materials are often observed to delaminate from soft substrates during...
| Hlavní autoři: | , , , , , |
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| Médium: | Journal article |
| Jazyk: | English |
| Vydáno: |
American Chemical Society
2018
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