Development of a miniature vapor compression refrigeration system for electronic cooling
Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems are now approaching their limits and in future alternative techniques/devices will be needed. A 3-year project, involving collaboration between groups at three UK universities, is being undertaken to...
| المؤلفون الرئيسيون: | , , , , , , , |
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| التنسيق: | Journal article |
| اللغة: | English |
| منشور في: |
2010
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