Lead free solders for aerospace applications
The factors controlling the reliability of Pb-free solders when subject to thermomechanical regimes relevant to the harsh aerospace environment have been studied. Ball grid array (BGAs) typical of microelectronic devices have been manufactured in-house and subjected to isothermal ageing and thermal...
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| Format: | Praca dyplomowa |
| Język: | English |
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2010
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