Lead free solders for aerospace applications

Lead free solders for aerospace applications

The factors controlling the reliability of Pb-free solders when subject to thermomechanical regimes relevant to the harsh aerospace environment have been studied. Ball grid array (BGAs) typical of microelectronic devices have been manufactured in-house and subjected to isothermal ageing and thermal...

书目详细资料
主要作者:	Farinha Marques, VM
其他作者:	Grant, P
格式:	Thesis
语言:	English
出版:	2010
主题:	Metallurgy Electronics Materials modelling Alloys Structure of interfaces Physical metallurgy Fatigue Materials processing Microscopy and microanalysis

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