Thermal diffusivity recovery and defect annealing kinetics of self-ion implanted tungsten prob e d by insitu transient grating spectroscopy

Tungsten is a promising candidate material for plasma-facing armour components in future fusion reactors. A key concern is irradiation-induced degradation of its normally excellent thermal transport properties. In this comprehensive study, thermal diffusivity degradation in ion-implanted tungsten an...

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Main Authors: Reza, A, He, G, Dennett, CA, Yu, H, Mizohata, K, Hofmann, F
格式: Journal article
语言:English
出版: Elsevier 2022
实物特征
总结:Tungsten is a promising candidate material for plasma-facing armour components in future fusion reactors. A key concern is irradiation-induced degradation of its normally excellent thermal transport properties. In this comprehensive study, thermal diffusivity degradation in ion-implanted tungsten and its evolution from room temperature (RT) to 1073 K is considered. Five samples were exposed to 20 MeV self-ions at RT to achieve damage levels ranging from 3.2 × 10−4 to 3.2 displacements per atom (dpa). Transient grating spectroscopy with insitu heating was then used to study thermal diffusivity evolution as a function of temperature. Using a kinetic theory model, an equivalent point defect density is estimated from the measured thermal diffusivity. The results showed a prominent recovery of thermal diffusivity between 450 K and 650 K, which coincides with the onset of mono-vacancy mobility. After 1073 K annealing samples with initial damage of 3.2 × 10−3 dpa or less recover close to the pristine value of thermal diffusivity. For doses of 3.2 × 10−2 dpa or higher, on the other hand, a residual reduction in thermal diffusivity remains even after 1073 K annealing. Transmission electron microscopy reveals that this is associated with extended, irradiation-induced dislocation structures that are retained after annealing. A sensitivity analysis shows that thermal diffusivity provides an efficient tool for assessing total defect content in tungsten up to 1000 K.