Debonding of a weak interface in front of a through-thickness crack
A through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K -field of the main crack. Plane approximation estimates of critical interfacial strength for crack defl...
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| Формат: | Journal article |
| Язык: | English |
| Опубликовано: |
Springer Science+Business Media
2001
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| Итог: | A through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K -field of the main crack. Plane approximation estimates of critical interfacial strength for crack deflection are compared with 3D calculations using integral equation and weight function formulations. |
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