Debonding of a weak interface in front of a through-thickness crack
A through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K -field of the main crack. Plane approximation estimates of critical interfacial strength for crack defl...
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| Format: | Journal article |
| Language: | English |
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Springer Science+Business Media
2001
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| _version_ | 1826285463463264256 |
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| author | Korsunsky, A |
| author_facet | Korsunsky, A |
| author_sort | Korsunsky, A |
| collection | OXFORD |
| description | A through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K -field of the main crack. Plane approximation estimates of critical interfacial strength for crack deflection are compared with 3D calculations using integral equation and weight function formulations. |
| first_indexed | 2024-03-07T01:29:13Z |
| format | Journal article |
| id | oxford-uuid:930a2a89-0461-494d-b181-452c360b9cfa |
| institution | University of Oxford |
| language | English |
| last_indexed | 2024-03-07T01:29:13Z |
| publishDate | 2001 |
| publisher | Springer Science+Business Media |
| record_format | dspace |
| spelling | oxford-uuid:930a2a89-0461-494d-b181-452c360b9cfa2022-03-26T23:29:31ZDebonding of a weak interface in front of a through-thickness crackJournal articlehttp://purl.org/coar/resource_type/c_dcae04bcuuid:930a2a89-0461-494d-b181-452c360b9cfaEngineering and allied sciencesEnglishSymplectic Elements at OxfordSpringer Science+Business Media2001Korsunsky, AA through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K -field of the main crack. Plane approximation estimates of critical interfacial strength for crack deflection are compared with 3D calculations using integral equation and weight function formulations. |
| spellingShingle | Engineering and allied sciences Korsunsky, A Debonding of a weak interface in front of a through-thickness crack |
| title | Debonding of a weak interface in front of a through-thickness crack |
| title_full | Debonding of a weak interface in front of a through-thickness crack |
| title_fullStr | Debonding of a weak interface in front of a through-thickness crack |
| title_full_unstemmed | Debonding of a weak interface in front of a through-thickness crack |
| title_short | Debonding of a weak interface in front of a through-thickness crack |
| title_sort | debonding of a weak interface in front of a through thickness crack |
| topic | Engineering and allied sciences |
| work_keys_str_mv | AT korsunskya debondingofaweakinterfaceinfrontofathroughthicknesscrack |