Debonding of a weak interface in front of a through-thickness crack

Debonding of a weak interface in front of a through-thickness crack

A through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K -field of the main crack. Plane approximation estimates of critical interfacial strength for crack defl...

Bibliografske podrobnosti
Glavni avtor:	Korsunsky, A
Format:	Journal article
Jezik:	English
Izdano:	Springer Science+Business Media 2001
Teme:	Engineering and allied sciences

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