Grain boundary engineering for crack bridging: A new model for intergranular stress corrosion crack (IGSCC) propagation
This chapter introduces a new intergranular stress corrosion crack (IGSCC) propagation model based on grain bridging by crack resistant, low energy grain boundary, (GB), and their related triple junction density (TJD). A stochastic model considers the frequency of immune GBs with respect to the micr...
| मुख्य लेखकों: | , , , |
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| स्वरूप: | Journal article |
| भाषा: | English |
| प्रकाशित: |
Elsevier
2008
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