The processing, microstructure and creep properties of Pb-free solders for harsh environments

The processing, microstructure and creep properties of Pb-free solders for harsh environments

<p>The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-free solders in the 25-150°C temperature range has been studied using nanoindentation and various new meso-scale tests. All alloys have been studied as bulk wave soldering bars, as-received so...

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Bibliografiske detaljer
Hovedforfatter:	Godard Desmarest, S
Andre forfattere:	Grant, P
Format:	Thesis
Sprog:	English
Udgivet:	2013
Fag:	Materials Sciences Physical Sciences

Lignende værker

Determination of the creep properties of Pb-free solders for harsh environments using meso-scale testing
af: Godard Desmarest, S, et al.
Udgivet: (2012)

Nanoindentation of lead free solders for harsh environments
af: Marques, V, et al.
Udgivet: (2008)

A comparative study of die attach strategies for use in harsh environments
af: Moreira de Sousa, M
Udgivet: (2012)

Development of Pb-free solder for electronic assembly
af: Li, Guoyuan.
Udgivet: (2008)

Mathematical and physical modeling of flip-chip soldering processes
af: Deering, Scott E. (Scott Earl), 1967-
Udgivet: (2005)

Creep Properties Assessment by Shear Punch Creep Test and IMC Morphology of Aged Pb-Free Solder Joint/UBM
af: Sophal Hai, et al.
Udgivet: (2019-02-01)

Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
af: Abdullah, Nabihah
Udgivet: (2019)

Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
af: Abdullah, Nabihah
Udgivet: (2019)

Effects of processing on microstructure and properties of Ti-Ta Alloys
af: Gortikov, Bryan (Bryan S.)
Udgivet: (2010)

Outstanding nonlinear optical properties of all-inorganic perovskite CsPbX3 (X=Cl, Br, I) precursor solutions and polycrystalline films
af: Yue Fu, et al.
Udgivet: (2023-12-01)

Industrial attachment report on quality and reliability of Pb-free solder joint
af: Marsellus Yohz Hendryanto
Udgivet: (2008)

Processing, microstructure and properties of polymer-based nano-composite dielectrics for capacitor applications
af: Mahadevegowda, A
Udgivet: (2014)

Reactive infiltration processing and compression creep of NiAl and NiAl composites
af: Ventakesh, T. A., 1970-
Udgivet: (2010)

Evaluation of optical solder for fiber-to-waveguide coupling in silicon photonics
af: Tjioe, Fidelia
Udgivet: (2009)

Wettability of low Sn solders on integrated circuit package metallizations
af: Gabriel, Michelle Wendy
Udgivet: (2008)

Microstructure and superconducting properties of Sn–In and Sn–In–Bi alloys as Pb-free superconducting solders
af: Mousavi, T, et al.
Udgivet: (2015)

Lead free solders for aerospace applications
af: Farinha Marques, VM
Udgivet: (2010)

Influence of processing methods on microstructure and multiscale functional properties of nitinol
af: Wang, Z
Udgivet: (2022)

Indentation creep study on metal composite solder with different particle size
af: Liu, Ye.
Udgivet: (2013)

In situ polarization and dielectric property measurements of Pb(Zr0.52Ti0.48)O3 ferroelectric nanocrystals
af: Haifa Zhai, et al.
Udgivet: (2017-06-01)

Bending fatigue and creep of tough matrix laminates
af: Gul, Rizwan Mahmood, 1967-
Udgivet: (2005)

Formation and processing of rheocast microstructures
af: Martínez-Ayers, Raúl Andrés, 1977-
Udgivet: (2005)

Creep deformation of low melting point SN-BI solder alloys by nanoindentation
af: Shen, Lu
Udgivet: (2014)

Microstructure and mechanical properties of bamboo in compression
af: Gerhardt, Michael R
Udgivet: (2013)

The creep rupture behavior of notched bars of IN-X750
af: Vasatis, Ioannis Platon
Udgivet: (2011)

Creep deformation in nickel base superalloy single crystals
af: Pollock, T. M. (Tresa M.)
Udgivet: (2021)

Creep rupture mechanisms in notched specimens of Rene 95
af: Peltier, Jon Michael
Udgivet: (2019)

High temperature Au-based solder reliability in electronic packages for harsh environments
af: Sousa, M, et al.
Udgivet: (2011)

Effect of oxygen on creep crack growth in nickel-base superalloys
af: Bain, Kenneth Rees
Udgivet: (2007)

LCD, low-temperature soldering and compound semiconductor : the sources, market, applications and future prospects of indium in Malaysia
af: Yong, Foo Nun
Udgivet: (2007)

Soldering alloys : composition, microstructure and joint characteristics
af: Ang, Edwin Hui Jun
Udgivet: (2010)

Understanding electronic and optical properties of PbS QDs for improved photovoltaic performance
af: Kim, Donghun, Ph. D. Massachusetts Institute of Technology
Udgivet: (2016)

Protocol to predict mechanical properties of multi-element ceramics using machine learning
af: Yunqing Tang, et al.
Udgivet: (2022-09-01)

Effects of crystal growth process parameters on the microstructural optical and electrical properties of CdTe and CdMnTe
af: Nakos, James Spiros
Udgivet: (2005)

Fracture properties of Sn-37Pb and Sn-3.5Ag solder joints
af: Siow, Kim Shyong.
Udgivet: (2008)

Lithium deposition and stripping in solid-state battery via coble creep
af: Wang, Ziqiang,Ph. D.Massachusetts Institute of Technology.
Udgivet: (2020)

Study of the microstructure and mechanical properties of hummingbird wing-bones
af: Kish, Tatiana Marie
Udgivet: (2016)

Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
af: Noritake HIYOSHI
Udgivet: (2016-05-01)

Protocol for developing an explosion-propeller hybrid driving underwater robot for AI-based concrete overhaul in real marine environments
af: Chenjie Zhang, et al.
Udgivet: (2024-12-01)

Controlling microstructure of nanocrystalline thermoelectrics through powder processing
af: Humphry-Baker, Samuel A
Udgivet: (2014)