The processing, microstructure and creep properties of Pb-free solders for harsh environments

The processing, microstructure and creep properties of Pb-free solders for harsh environments

<p>The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-free solders in the 25-150°C temperature range has been studied using nanoindentation and various new meso-scale tests. All alloys have been studied as bulk wave soldering bars, as-received so...

書誌詳細
第一著者:	Godard Desmarest, S
その他の著者:	Grant, P
フォーマット:	学位論文
言語:	English
出版事項:	2013
主題:	Materials Sciences Physical Sciences

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