The processing, microstructure and creep properties of Pb-free solders for harsh environments
<p>The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-free solders in the 25-150°C temperature range has been studied using nanoindentation and various new meso-scale tests. All alloys have been studied as bulk wave soldering bars, as-received so...
1. autor: | Godard Desmarest, S |
---|---|
Kolejni autorzy: | Grant, P |
Format: | Praca dyplomowa |
Język: | English |
Wydane: |
2013
|
Hasła przedmiotowe: |
Podobne zapisy
-
Determination of the creep properties of Pb-free solders for harsh environments using meso-scale testing
od: Godard Desmarest, S, i wsp.
Wydane: (2012) -
Nanoindentation of lead free solders for harsh environments
od: Marques, V, i wsp.
Wydane: (2008) -
A comparative study of die attach strategies for use in harsh environments
od: Moreira de Sousa, M
Wydane: (2012) -
Development of Pb-free solder for electronic assembly
od: Li, Guoyuan.
Wydane: (2008) -
Mathematical and physical modeling of flip-chip soldering processes
od: Deering, Scott E. (Scott Earl), 1967-
Wydane: (2005)