Microstructural characterisation of spray formed Si-30Al for thermal management applications
This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ~5μ equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ~10 μm equiaxed Al-rich grains interpenetrati...
| Päätekijät: | , , , |
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| Aineistotyyppi: | Journal article |
| Kieli: | English |
| Julkaistu: |
Elsevier
2006
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| Aiheet: |
| Yhteenveto: | This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ~5μ equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ~10 μm equiaxed Al-rich grains interpenetrating the Si network with no evidence of a lamellar Al-Si eutectic. This unusual microstructure arose because of the particular solidification conditions during and immediately after the spray forming process and the large alloy freezing range. |
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