Microstructural characterisation of spray formed Si-30Al for thermal management applications
This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ~5μ equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ~10 μm equiaxed Al-rich grains interpenetrati...
| Главные авторы: | , , , |
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| Формат: | Journal article |
| Язык: | English |
| Опубликовано: |
Elsevier
2006
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| Предметы: |
| _version_ | 1826299216961470464 |
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| author | Hogg, S Lambourne, A Ogilvy, A Grant, P |
| author_facet | Hogg, S Lambourne, A Ogilvy, A Grant, P |
| author_sort | Hogg, S |
| collection | OXFORD |
| description | This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ~5μ equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ~10 μm equiaxed Al-rich grains interpenetrating the Si network with no evidence of a lamellar Al-Si eutectic. This unusual microstructure arose because of the particular solidification conditions during and immediately after the spray forming process and the large alloy freezing range. |
| first_indexed | 2024-03-07T04:58:33Z |
| format | Journal article |
| id | oxford-uuid:d774961c-ddef-4d6b-a382-1a30b58c6a85 |
| institution | University of Oxford |
| language | English |
| last_indexed | 2024-03-07T04:58:33Z |
| publishDate | 2006 |
| publisher | Elsevier |
| record_format | dspace |
| spelling | oxford-uuid:d774961c-ddef-4d6b-a382-1a30b58c6a852022-03-27T08:41:14ZMicrostructural characterisation of spray formed Si-30Al for thermal management applicationsJournal articlehttp://purl.org/coar/resource_type/c_dcae04bcuuid:d774961c-ddef-4d6b-a382-1a30b58c6a85Materials SciencesEnglishOxford University Research Archive - ValetElsevier2006Hogg, SLambourne, AOgilvy, AGrant, PThis paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ~5μ equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ~10 μm equiaxed Al-rich grains interpenetrating the Si network with no evidence of a lamellar Al-Si eutectic. This unusual microstructure arose because of the particular solidification conditions during and immediately after the spray forming process and the large alloy freezing range. |
| spellingShingle | Materials Sciences Hogg, S Lambourne, A Ogilvy, A Grant, P Microstructural characterisation of spray formed Si-30Al for thermal management applications |
| title | Microstructural characterisation of spray formed Si-30Al for thermal management applications |
| title_full | Microstructural characterisation of spray formed Si-30Al for thermal management applications |
| title_fullStr | Microstructural characterisation of spray formed Si-30Al for thermal management applications |
| title_full_unstemmed | Microstructural characterisation of spray formed Si-30Al for thermal management applications |
| title_short | Microstructural characterisation of spray formed Si-30Al for thermal management applications |
| title_sort | microstructural characterisation of spray formed si 30al for thermal management applications |
| topic | Materials Sciences |
| work_keys_str_mv | AT hoggs microstructuralcharacterisationofsprayformedsi30alforthermalmanagementapplications AT lambournea microstructuralcharacterisationofsprayformedsi30alforthermalmanagementapplications AT ogilvya microstructuralcharacterisationofsprayformedsi30alforthermalmanagementapplications AT grantp microstructuralcharacterisationofsprayformedsi30alforthermalmanagementapplications |