Bridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delamination
Z-pin through-thickness reinforcement is used to improve the impact resistance of composite structures; however, the effect of loading rate on Z-pin behaviour is not well understood. The dyna mic response of Z-pins in mode I and II delamination of quasi-isotropic IM7/8552 laminates was characterized...
Main Authors: | , , , , , , , |
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Format: | Journal article |
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Elsevier
2017
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_version_ | 1797104324533288960 |
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author | Cui, H Yasaee, M Kalwak, G Pellegrino, A Partridge, IK Hallett, SR Allegri, G Petrinic, N |
author_facet | Cui, H Yasaee, M Kalwak, G Pellegrino, A Partridge, IK Hallett, SR Allegri, G Petrinic, N |
author_sort | Cui, H |
collection | OXFORD |
description | Z-pin through-thickness reinforcement is used to improve the impact resistance of composite structures; however, the effect of loading rate on Z-pin behaviour is not well understood. The dyna mic response of Z-pins in mode I and II delamination of quasi-isotropic IM7/8552 laminates was characterized experimentally in this work. Z-pinned samples were loaded at both quasi-static and dynamic rates, up to a separation velocity of 12 m/s. The efficiency of Z-pins in mode I delamination decreased with loading rate, which was mainly due to the change in the pin misalignment, the failure surface morphology and to inertia. The Z-pins failed at small displacements in the mode II loading experiments, resulting in much lower energy dissipation in comparison with the mode I case. The total energy dissipation decreased with increasing loading rate, while enhanced interfacial friction due to failed pins may be largely responsible for the higher energy dissipation in quasi-static experiments. |
first_indexed | 2024-03-07T06:32:12Z |
format | Journal article |
id | oxford-uuid:f65e5d6a-8d99-496e-8451-880afbe08fc7 |
institution | University of Oxford |
last_indexed | 2024-03-07T06:32:12Z |
publishDate | 2017 |
publisher | Elsevier |
record_format | dspace |
spelling | oxford-uuid:f65e5d6a-8d99-496e-8451-880afbe08fc72022-03-27T12:34:38ZBridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delaminationJournal articlehttp://purl.org/coar/resource_type/c_dcae04bcuuid:f65e5d6a-8d99-496e-8451-880afbe08fc7Symplectic Elements at OxfordElsevier2017Cui, HYasaee, MKalwak, GPellegrino, APartridge, IKHallett, SRAllegri, GPetrinic, NZ-pin through-thickness reinforcement is used to improve the impact resistance of composite structures; however, the effect of loading rate on Z-pin behaviour is not well understood. The dyna mic response of Z-pins in mode I and II delamination of quasi-isotropic IM7/8552 laminates was characterized experimentally in this work. Z-pinned samples were loaded at both quasi-static and dynamic rates, up to a separation velocity of 12 m/s. The efficiency of Z-pins in mode I delamination decreased with loading rate, which was mainly due to the change in the pin misalignment, the failure surface morphology and to inertia. The Z-pins failed at small displacements in the mode II loading experiments, resulting in much lower energy dissipation in comparison with the mode I case. The total energy dissipation decreased with increasing loading rate, while enhanced interfacial friction due to failed pins may be largely responsible for the higher energy dissipation in quasi-static experiments. |
spellingShingle | Cui, H Yasaee, M Kalwak, G Pellegrino, A Partridge, IK Hallett, SR Allegri, G Petrinic, N Bridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delamination |
title | Bridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delamination |
title_full | Bridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delamination |
title_fullStr | Bridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delamination |
title_full_unstemmed | Bridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delamination |
title_short | Bridging mechanisms of through-thickness reinforcement in dynamic mode Iⅈ delamination |
title_sort | bridging mechanisms of through thickness reinforcement in dynamic mode i amp ii delamination |
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