Electrochemical corrosion behaviour of Pb-free SAC 105 and SAC 305 solder alloys: a comparative study
Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Sn-3.0Ag, Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu was investigated in 3.5% NaCl solution by potentiodynamic polarization and ele...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2017
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| Online Access: | http://journalarticle.ukm.my/10682/1/14%20M.%20Fayer.pdf |
| Summary: | Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Sn-3.0Ag, Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu was investigated in 3.5% NaCl solution by potentiodynamic polarization and electrochemical impedance spectroscopy. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) were used to characterize the samples after the tests. The results showed that the addition of 0.5 wt. % copper with Sn-3.0 Ag solder alloy led to a better corrosion resistance while lowering of Ag content from 3.0 to 1.0 wt. % decreased the resistance. Sn-3.0Ag-0.5Cu exhibits a better corrosion resistance in terms of increased charge transfer resistance and impedance values as well as the lowest capacitance. These characteristics signify its suitability for the application in electronic packaging. |
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