Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints
The formation and growth of intermetallic compounds (IMCs) between lead-free solder alloys and Cu substrate were investigated. Cu6Sn5 IMC was formed in the Sn–3Ag–0.5Cu solder joint, whilst Cu5Zn8 IMC was formed in the Sn–9Zn and Sn–8Zn–3Bi solder joints after soldering. After exposure to a current...
| Главные авторы: | , , , , |
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| Формат: | Статья |
| Опубликовано: |
Elsevier
2012
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