Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin
This work focuses on the investigation of the electrochemical behavior of Sn–Bi plating bath modified by two electrolyte additives, hydroquinone (HQ) and gelatin. Electrochemical studies were carried out by low sweep rate polarization scans, as well as cyclic voltammetry at different scan rates (1–4...
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Kluwer (now part of Springer)
2016
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