Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration

Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration

Rapid Cu diffusion is one of the main causes of electromigration (EM) failure in lead-free solder joints. In this study, an effort has been made to investigate the detrimental effects of EM on microstructure and mechanical performance of solder joint by introducing Co nanoparticles (NP) doped flux a...

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Bibliographic Details
Main Authors:	Bashir, M.N., Haseeb, A.S. Md. Abdul, Rahman, A.Z.M.S., Fazal, M.A.
Format:	Article
Published:	Elsevier 2016
Subjects:	TJ Mechanical engineering and machinery

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