Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing’s formula using energy-dispersive x-rays
The leadframe fabrication process normally involves additional thin-metal layer plating on the bulk copper substrate surface for wire bonding purposes. Silver, tin, and copper flakes are commonly adopted as plating materials. It is critical to assess the density of the plated metal layer, and in par...
| Κύριοι συγγραφείς: | , , , , |
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| Μορφή: | Άρθρο |
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International Society for Optical Engineering (SPIE)
2015
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