Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts
The present study predicts the structural damage on polycarbonate enclosures of electronic devices in multiple ball impact tests, achieved through numerical simulation and experiments. A novel methodology in modelling repeated ball impacts was established and proven. It was found that the finite ele...
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| Format: | Article |
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Elsevier
2018
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| _version_ | 1796960852389134336 |
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| author | Yau, Yat Huang Hua, Shijie Norman Kok, Chee Kuang |
| author_facet | Yau, Yat Huang Hua, Shijie Norman Kok, Chee Kuang |
| author_sort | Yau, Yat Huang |
| collection | UM |
| description | The present study predicts the structural damage on polycarbonate enclosures of electronic devices in multiple ball impact tests, achieved through numerical simulation and experiments. A novel methodology in modelling repeated ball impacts was established and proven. It was found that the finite element model must be allowed to achieve static equilibrium at the end of each impact before the next impact. The ball impact was performed on the polycarbonate enclosures at different heights ranging from 20 to 70 cm. The results suggested that the maximum penetration depth from both finite element analysis (FEA) and experiment were in good agreement. The failure sites were also predicted with reasonable consistency. |
| first_indexed | 2024-03-06T05:50:47Z |
| format | Article |
| id | um.eprints-20292 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:50:47Z |
| publishDate | 2018 |
| publisher | Elsevier |
| record_format | dspace |
| spelling | um.eprints-202922019-02-13T06:53:29Z http://eprints.um.edu.my/20292/ Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts Yau, Yat Huang Hua, Shijie Norman Kok, Chee Kuang TJ Mechanical engineering and machinery The present study predicts the structural damage on polycarbonate enclosures of electronic devices in multiple ball impact tests, achieved through numerical simulation and experiments. A novel methodology in modelling repeated ball impacts was established and proven. It was found that the finite element model must be allowed to achieve static equilibrium at the end of each impact before the next impact. The ball impact was performed on the polycarbonate enclosures at different heights ranging from 20 to 70 cm. The results suggested that the maximum penetration depth from both finite element analysis (FEA) and experiment were in good agreement. The failure sites were also predicted with reasonable consistency. Elsevier 2018 Article PeerReviewed Yau, Yat Huang and Hua, Shijie Norman and Kok, Chee Kuang (2018) Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts. Polymer Testing, 65. pp. 374-386. ISSN 0142-9418, DOI https://doi.org/10.1016/j.polymertesting.2017.12.013 <https://doi.org/10.1016/j.polymertesting.2017.12.013>. https://doi.org/10.1016/j.polymertesting.2017.12.013 doi:10.1016/j.polymertesting.2017.12.013 |
| spellingShingle | TJ Mechanical engineering and machinery Yau, Yat Huang Hua, Shijie Norman Kok, Chee Kuang Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts |
| title | Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts |
| title_full | Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts |
| title_fullStr | Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts |
| title_full_unstemmed | Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts |
| title_short | Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts |
| title_sort | structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts |
| topic | TJ Mechanical engineering and machinery |
| work_keys_str_mv | AT yauyathuang structuralfailureanalysisofpolycarbonateenclosuresofelectronicdevicessubjectedtomultipleballimpacts AT huashijienorman structuralfailureanalysisofpolycarbonateenclosuresofelectronicdevicessubjectedtomultipleballimpacts AT kokcheekuang structuralfailureanalysisofpolycarbonateenclosuresofelectronicdevicessubjectedtomultipleballimpacts |