Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts
The present study predicts the structural damage on polycarbonate enclosures of electronic devices in multiple ball impact tests, achieved through numerical simulation and experiments. A novel methodology in modelling repeated ball impacts was established and proven. It was found that the finite ele...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Published: |
Elsevier
2018
|
| Subjects: |