Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma (Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging)

Kesan Penambahan Tiubnano Karbon terhadap Pertumbuhan Lapisan Sebatian antara Logam Sistem Pateri Sn-Ag-Cu/Cu akibat Penuaan Terma (Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging)

Effect of carbon nanotube (CNT) on the growth of intermetallic compound (IMC) layer of 96.5Sn-3.0Ag-0.5Cu/Cu substrate lead free solder system has been investigated. Sn-Ag-Cu alloy powder (SAC305) was mixed with 0.02 weight percent of CNT to produce SAC-CNT solder paste. Both SAC305 and SAC305-CNT s...

Full description

Bibliographic Details
Main Authors:	Ismail, Norliza, Jalar, Azman, Abu Bakar, Maria, Ismail, Roslina
Format:	Article
Published:	Penerbit Universiti Kebangsaan Malaysia 2018
Subjects:	N Visual arts (General) For photography, see TR TJ Mechanical engineering and machinery

Similar Items

Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano (Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation)
by: Ismail, Norliza, et al.
Published: (2019)

Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys
by: Shnawah, D.A., et al.
Published: (2015)

Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys
by: Shnawah, D.A., et al.
Published: (2015)

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)

A review on mechanical properties of SnAgCu/Cu joint using laser soldering
by: Nabila, Tamar Jaya, et al.
Published: (2018)

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg
by: M.A., Rabiatul Adawiyah, et al.
Published: (2019)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)

Fracture of Sn-Ag-Cu solder joints on Cu substrates : I. effects of loading and processing conditions
by: Pang, John Hock Lye, et al.
Published: (2013)

Effect of addition cobalt nanoparticles on Sn-Ag-Cu lead-free solder
by: Tay, S.L., et al.
Published: (2010)

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)

Fracture toughness of Cu-Sn intermetallic thin films
by: Li, M., et al.
Published: (2012)

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
by: Nai, S. M. L., et al.
Published: (2013)

The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)

Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film
by: Haseeb, A.S. Md. Abdul, et al.
Published: (2018)

Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds
by: Haseeb, A.S. Md. Abdul, et al.
Published: (2012)

Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)

Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2013)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)

Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
by: Mayappan, Ramani, et al.
Published: (2010)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)

Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
by: Ridhai, Mohammed Noori
Published: (2010)

A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)

Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints
by: Othman, R., et al.
Published: (2012)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)

Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
by: Lee , Liu Mei
Published: (2013)

Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
by: Ab Ghani, Noor Asikin
Published: (2016)

The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
by: Yahya, Iziana, et al.
Published: (2012)

Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate
by: Ghani, Fitriah Abdul
Published: (2018)

Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
by: Mohamed Anuar, Rabiatul Adawiyah, et al.
Published: (2020)

Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)

Reflow of Sn-3.8Ag-O.7Cu solder on Ni substrate in presence of Mo nanoparticles
by: Mahdavifard, M.H., et al.
Published: (2013)

Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)

A new creep model for SnAgCu lead-free composite solders : incorporating back stress
by: Nai, S. M. L., et al.
Published: (2010)

Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints
by: Nai, S. M. L., et al.
Published: (2013)

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
by: Leong, Y.M., et al.
Published: (2016)

Brazeability and mechanical properties of Ag-Cu-Sn brazing filler metals on copper-brazed joint
by: Basri, D.K., et al.
Published: (2014)

Efficiency enhancement and doping type inversion in Cu₂CdSnS₄ solar cells by Ag substitution
by: Ibrahim, Ahmad, et al.
Published: (2024)