Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film
Tin-based multilayered thin films were fabricated for application in three dimensional microelectronic packaging as joining materials. During device fabrication and application, interconnecting materials can be fully converted to intermetallic compounds (IMCs). As known, IMCs are generally brittle a...
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| Format: | Article |
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Springer
2018
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| author | Haseeb, A.S. Md. Abdul Rahman, Abu Zayed Mohammad Saliqur Chia, Pay Ying |
| author_facet | Haseeb, A.S. Md. Abdul Rahman, Abu Zayed Mohammad Saliqur Chia, Pay Ying |
| author_sort | Haseeb, A.S. Md. Abdul |
| collection | UM |
| description | Tin-based multilayered thin films were fabricated for application in three dimensional microelectronic packaging as joining materials. During device fabrication and application, interconnecting materials can be fully converted to intermetallic compounds (IMCs). As known, IMCs are generally brittle and associated with void formation which can make interconnection in the microelectronic devices vulnerable. In an effort to improve the reliability of the Sn–Cu based IMC, ultra thin layers of Ni (70 nm) were inserted into Cu/Sn system. Electrochemical deposition technique was used to fabricate the samples. Isothermal aging at 150 °C for 168 h was performed to grow the IMCs at required thickness for measuring creep by nanoindentation. Creep strain rate was calculated from experimental data. Creep resistance was significantly improved after adding the small amount of Ni in Cu/Sn multilayered thin film system. |
| first_indexed | 2024-03-06T05:55:32Z |
| format | Article |
| id | um.eprints-21927 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:55:32Z |
| publishDate | 2018 |
| publisher | Springer |
| record_format | dspace |
| spelling | um.eprints-219272019-08-08T08:19:04Z http://eprints.um.edu.my/21927/ Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film Haseeb, A.S. Md. Abdul Rahman, Abu Zayed Mohammad Saliqur Chia, Pay Ying TJ Mechanical engineering and machinery Tin-based multilayered thin films were fabricated for application in three dimensional microelectronic packaging as joining materials. During device fabrication and application, interconnecting materials can be fully converted to intermetallic compounds (IMCs). As known, IMCs are generally brittle and associated with void formation which can make interconnection in the microelectronic devices vulnerable. In an effort to improve the reliability of the Sn–Cu based IMC, ultra thin layers of Ni (70 nm) were inserted into Cu/Sn system. Electrochemical deposition technique was used to fabricate the samples. Isothermal aging at 150 °C for 168 h was performed to grow the IMCs at required thickness for measuring creep by nanoindentation. Creep strain rate was calculated from experimental data. Creep resistance was significantly improved after adding the small amount of Ni in Cu/Sn multilayered thin film system. Springer 2018 Article PeerReviewed Haseeb, A.S. Md. Abdul and Rahman, Abu Zayed Mohammad Saliqur and Chia, Pay Ying (2018) Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film. Journal of Materials Science: Materials in Electronics, 29 (2). pp. 1258-1263. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-017-8030-z <https://doi.org/10.1007/s10854-017-8030-z>. https://doi.org/10.1007/s10854-017-8030-z doi:10.1007/s10854-017-8030-z |
| spellingShingle | TJ Mechanical engineering and machinery Haseeb, A.S. Md. Abdul Rahman, Abu Zayed Mohammad Saliqur Chia, Pay Ying Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| title | Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| title_full | Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| title_fullStr | Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| title_full_unstemmed | Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| title_short | Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| title_sort | nanoindentation creep on cu3sn cu6sn5 and cu ni 6sn5 intermetallic compounds grown in electrodeposited multilayered thin film |
| topic | TJ Mechanical engineering and machinery |
| work_keys_str_mv | AT haseebasmdabdul nanoindentationcreeponcu3sncu6sn5andcuni6sn5intermetalliccompoundsgrowninelectrodepositedmultilayeredthinfilm AT rahmanabuzayedmohammadsaliqur nanoindentationcreeponcu3sncu6sn5andcuni6sn5intermetalliccompoundsgrowninelectrodepositedmultilayeredthinfilm AT chiapayying nanoindentationcreeponcu3sncu6sn5andcuni6sn5intermetalliccompoundsgrowninelectrodepositedmultilayeredthinfilm |