Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers
Intermetallic compounds (IMC) form during the metallurgical bonding processes when the interfaces involve solid metal and molten solder. Cobalt (Co) is a promising candidate to be used as under bump metallization (UBM) material, tin (Sn)-based solder alloying element, and transient liquid phase bond...
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| Format: | Article |
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Springer
2018
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| author | Goh, Yingxin Goh, Yi Sing Lee, Ee Lynn Ong, Meng Teck Haseeb, A.S. Md. Abdul |
| author_facet | Goh, Yingxin Goh, Yi Sing Lee, Ee Lynn Ong, Meng Teck Haseeb, A.S. Md. Abdul |
| author_sort | Goh, Yingxin |
| collection | UM |
| description | Intermetallic compounds (IMC) form during the metallurgical bonding processes when the interfaces involve solid metal and molten solder. Cobalt (Co) is a promising candidate to be used as under bump metallization (UBM) material, tin (Sn)-based solder alloying element, and transient liquid phase bonding base metal. This work aims at studying the intermixing reaction in Co–Sn system from electroplated Co and Sn multilayers. Co–Sn couples were sequentially electroplated and reflowed at 400 °C for 1 and 4 h. The microstructure and composition of the phases formed at different reflow duration were characterized by field emission scanning electron microscopy (FESEM) coupled with energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). Mechanical properties of the IMC layers formed in the samples were characterized using the nanoindentation technique under quasi-static and continuous measurement modes. FESEM/EDX and XRD analysis showed a mixture of CoSn+CoSn2 phases was formed in the 1 h reflow sample. As reflow time was increased to 4 h, only CoSn phase was found. Pure CoSn phase exhibits high nanohardness of 9.51 GPa while the region with CoSn+CoSn2 phases gives nanohardness value of 6.83 GPa. |
| first_indexed | 2024-03-06T05:55:47Z |
| format | Article |
| id | um.eprints-22009 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:55:47Z |
| publishDate | 2018 |
| publisher | Springer |
| record_format | dspace |
| spelling | um.eprints-220092019-08-21T06:38:34Z http://eprints.um.edu.my/22009/ Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers Goh, Yingxin Goh, Yi Sing Lee, Ee Lynn Ong, Meng Teck Haseeb, A.S. Md. Abdul TJ Mechanical engineering and machinery Intermetallic compounds (IMC) form during the metallurgical bonding processes when the interfaces involve solid metal and molten solder. Cobalt (Co) is a promising candidate to be used as under bump metallization (UBM) material, tin (Sn)-based solder alloying element, and transient liquid phase bonding base metal. This work aims at studying the intermixing reaction in Co–Sn system from electroplated Co and Sn multilayers. Co–Sn couples were sequentially electroplated and reflowed at 400 °C for 1 and 4 h. The microstructure and composition of the phases formed at different reflow duration were characterized by field emission scanning electron microscopy (FESEM) coupled with energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). Mechanical properties of the IMC layers formed in the samples were characterized using the nanoindentation technique under quasi-static and continuous measurement modes. FESEM/EDX and XRD analysis showed a mixture of CoSn+CoSn2 phases was formed in the 1 h reflow sample. As reflow time was increased to 4 h, only CoSn phase was found. Pure CoSn phase exhibits high nanohardness of 9.51 GPa while the region with CoSn+CoSn2 phases gives nanohardness value of 6.83 GPa. Springer 2018 Article PeerReviewed Goh, Yingxin and Goh, Yi Sing and Lee, Ee Lynn and Ong, Meng Teck and Haseeb, A.S. Md. Abdul (2018) Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers. Journal of Materials Science: Materials in Electronics, 29 (7). pp. 5791-5798. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-018-8550-1 <https://doi.org/10.1007/s10854-018-8550-1>. https://doi.org/10.1007/s10854-018-8550-1 doi:10.1007/s10854-018-8550-1 |
| spellingShingle | TJ Mechanical engineering and machinery Goh, Yingxin Goh, Yi Sing Lee, Ee Lynn Ong, Meng Teck Haseeb, A.S. Md. Abdul Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers |
| title | Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers |
| title_full | Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers |
| title_fullStr | Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers |
| title_full_unstemmed | Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers |
| title_short | Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers |
| title_sort | formation and characterization of intermetallic compounds in electroplated cobalt tin multilayers |
| topic | TJ Mechanical engineering and machinery |
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