Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

Intermetallic compounds (IMC) form during the metallurgical bonding processes when the interfaces involve solid metal and molten solder. Cobalt (Co) is a promising candidate to be used as under bump metallization (UBM) material, tin (Sn)-based solder alloying element, and transient liquid phase bond...

Bibliografiset tiedot
Päätekijät:	Goh, Yingxin, Goh, Yi Sing, Lee, Ee Lynn, Ong, Meng Teck, Haseeb, A.S. Md. Abdul
Aineistotyyppi:	Artikkeli
Julkaistu:	Springer 2018
Aiheet:	TJ Mechanical engineering and machinery

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