Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux
The electromigration (EM) degrades the structural, mechanical and electrical properties of solder joints. An effort has been made to investigate the effects of the Ni nanoparticles (NP) doped flux on the mechanical properties and electrical resistance of SAC305 solder joints subjected to EM. SAC305...
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| Format: | Article |
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Springer
2018
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| author | Bashir, Muhammad Nasir Haseeb, A.S. Md. Abdul |
| author_facet | Bashir, Muhammad Nasir Haseeb, A.S. Md. Abdul |
| author_sort | Bashir, Muhammad Nasir |
| collection | UM |
| description | The electromigration (EM) degrades the structural, mechanical and electrical properties of solder joints. An effort has been made to investigate the effects of the Ni nanoparticles (NP) doped flux on the mechanical properties and electrical resistance of SAC305 solder joints subjected to EM. SAC305 solder joints were prepared using NP-doped flux. A current density of 3 × 103 A/cm2 was applied to the joints at a constant temperature of 150 °C. Tensile tests were performed before and after the EM tests. Results reveal that after the addition of Ni NP-doped flux, the mechanical strength improved before and after EM. After EM, the fracture path for doped solder joint did not migrate to the cathode side as compared to un-doped solder. Ni NP also improved the electrical resistance and lifetime of the solder joint. The use of Ni NP-doped flux thus minimized the effects of EM and improved the mechanical and electrical performance of the solder joints. |
| first_indexed | 2024-03-06T05:56:41Z |
| format | Article |
| id | um.eprints-22343 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:56:41Z |
| publishDate | 2018 |
| publisher | Springer |
| record_format | dspace |
| spelling | um.eprints-223432019-09-13T06:46:07Z http://eprints.um.edu.my/22343/ Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux Bashir, Muhammad Nasir Haseeb, A.S. Md. Abdul TJ Mechanical engineering and machinery The electromigration (EM) degrades the structural, mechanical and electrical properties of solder joints. An effort has been made to investigate the effects of the Ni nanoparticles (NP) doped flux on the mechanical properties and electrical resistance of SAC305 solder joints subjected to EM. SAC305 solder joints were prepared using NP-doped flux. A current density of 3 × 103 A/cm2 was applied to the joints at a constant temperature of 150 °C. Tensile tests were performed before and after the EM tests. Results reveal that after the addition of Ni NP-doped flux, the mechanical strength improved before and after EM. After EM, the fracture path for doped solder joint did not migrate to the cathode side as compared to un-doped solder. Ni NP also improved the electrical resistance and lifetime of the solder joint. The use of Ni NP-doped flux thus minimized the effects of EM and improved the mechanical and electrical performance of the solder joints. Springer 2018 Article PeerReviewed Bashir, Muhammad Nasir and Haseeb, A.S. Md. Abdul (2018) Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux. Journal of Materials Science: Materials in Electronics, 29 (4). pp. 3182-3188. ISSN 0957-4522, DOI https://doi.org/10.1007/s10854-017-8252-0 <https://doi.org/10.1007/s10854-017-8252-0>. https://doi.org/10.1007/s10854-017-8252-0 doi:10.1007/s10854-017-8252-0 |
| spellingShingle | TJ Mechanical engineering and machinery Bashir, Muhammad Nasir Haseeb, A.S. Md. Abdul Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux |
| title | Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux |
| title_full | Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux |
| title_fullStr | Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux |
| title_full_unstemmed | Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux |
| title_short | Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux |
| title_sort | improving mechanical and electrical properties of cu sac305 cu solder joints under electromigration by using ni nanoparticles doped flux |
| topic | TJ Mechanical engineering and machinery |
| work_keys_str_mv | AT bashirmuhammadnasir improvingmechanicalandelectricalpropertiesofcusac305cusolderjointsunderelectromigrationbyusingninanoparticlesdopedflux AT haseebasmdabdul improvingmechanicalandelectricalpropertiesofcusac305cusolderjointsunderelectromigrationbyusingninanoparticlesdopedflux |