Open-cell copper foam joining: joint strength and interfacial behaviour
A copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 MPa with a 127% increment compared to nonbrazed Cu foam. 15 PPI Cu foam produced a maximum shear strengt...
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| Format: | Article |
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Taylor & Francis
2019
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| author | Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana |
| author_facet | Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana |
| author_sort | Zahri, Nur Amirah Mohd |
| collection | UM |
| description | A copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 MPa with a 127% increment compared to nonbrazed Cu foam. 15 PPI Cu foam produced a maximum shear strength of 2.7 MPa. Scanning electron microscopy showed that the thickness of the brazed seam decreased with increasing the Cu foam’s PPI. The formation of the Cu, Cu3P (P: phosphorus) and Ni3P (Ni: nickel) at the Cu/Cu foam interface was validated using energy-dispersive X-ray spectroscopy (EDX) and X-ray diffraction. EDX line scanning analysis revealed the diffusion of P and Ni into Cu foam, which took place via capillary force action. © 2019, © 2019 Institute of Materials, Minerals and Mining. |
| first_indexed | 2024-03-06T06:01:27Z |
| format | Article |
| id | um.eprints-23981 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T06:01:27Z |
| publishDate | 2019 |
| publisher | Taylor & Francis |
| record_format | dspace |
| spelling | um.eprints-239812020-03-10T04:09:49Z http://eprints.um.edu.my/23981/ Open-cell copper foam joining: joint strength and interfacial behaviour Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana TJ Mechanical engineering and machinery A copper (Cu) foam was brazed with Cu-4.0Sn-9.9Ni-7.8P filler foil for joint strength and interface analysis. Brazed 50 pores per inch (PPI) Cu foam yielded a maximum compressive strength of 14.4 MPa with a 127% increment compared to nonbrazed Cu foam. 15 PPI Cu foam produced a maximum shear strength of 2.7 MPa. Scanning electron microscopy showed that the thickness of the brazed seam decreased with increasing the Cu foam’s PPI. The formation of the Cu, Cu3P (P: phosphorus) and Ni3P (Ni: nickel) at the Cu/Cu foam interface was validated using energy-dispersive X-ray spectroscopy (EDX) and X-ray diffraction. EDX line scanning analysis revealed the diffusion of P and Ni into Cu foam, which took place via capillary force action. © 2019, © 2019 Institute of Materials, Minerals and Mining. Taylor & Francis 2019 Article PeerReviewed Zahri, Nur Amirah Mohd and Yusof, Farazila and Ariga, Tadashi and Haseeb, A.S. Md. Abdul and Mansoor, Muhammad Adil and Sukiman, Nazatul Liana (2019) Open-cell copper foam joining: joint strength and interfacial behaviour. Materials Science and Technology, 35 (16). pp. 2004-2012. ISSN 0267-0836, DOI https://doi.org/10.1080/02670836.2019.1661649 <https://doi.org/10.1080/02670836.2019.1661649>. https://doi.org/10.1080/02670836.2019.1661649 doi:10.1080/02670836.2019.1661649 |
| spellingShingle | TJ Mechanical engineering and machinery Zahri, Nur Amirah Mohd Yusof, Farazila Ariga, Tadashi Haseeb, A.S. Md. Abdul Mansoor, Muhammad Adil Sukiman, Nazatul Liana Open-cell copper foam joining: joint strength and interfacial behaviour |
| title | Open-cell copper foam joining: joint strength and interfacial behaviour |
| title_full | Open-cell copper foam joining: joint strength and interfacial behaviour |
| title_fullStr | Open-cell copper foam joining: joint strength and interfacial behaviour |
| title_full_unstemmed | Open-cell copper foam joining: joint strength and interfacial behaviour |
| title_short | Open-cell copper foam joining: joint strength and interfacial behaviour |
| title_sort | open cell copper foam joining joint strength and interfacial behaviour |
| topic | TJ Mechanical engineering and machinery |
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