Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior
In this work, brazing of porous copper foam (PCF) to copper (Cu) using amorphous Cu-9.7Sn-5.7Ni-7.0P (in weight, wt%) filler metal has been performed. PCF with different pore densities of 15 pore per inch (PPI), 25 PPI, and 50 PPI were sandwiched in between amorphous Cu-9.7Sn-5.7Ni-7.0P filler/Cu ba...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Published: |
Springer Verlag (Germany)
2020
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| Subjects: |