Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt...

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Bibliographic Details
Main Authors:	Tay, S.L., Haseeb, A.S. Md. Abdul, Johan, M.R.
Format:	Article
Published:	2011
Subjects:	T Technology (General)

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