Cooling of minichannel heat sink using nanofluids

Nanofluids contain a small fraction of solid nanoparticles in base fluids. Nanofluids cooled small channel heat sinks, have been anticipated to be an excellent heat dissipation method for the next generation electronic devices. In this study, nanofluids are used with different volume fractions of na...

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Main Authors: Ijam, A., Saidur, Rahman, Ganesan, P.
Format: Article
Published: International Communications in Heat and Mass Transfer 2012
Subjects:
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author Ijam, A.
Saidur, Rahman
Ganesan, P.
author_facet Ijam, A.
Saidur, Rahman
Ganesan, P.
author_sort Ijam, A.
collection UM
description Nanofluids contain a small fraction of solid nanoparticles in base fluids. Nanofluids cooled small channel heat sinks, have been anticipated to be an excellent heat dissipation method for the next generation electronic devices. In this study, nanofluids are used with different volume fractions of nanoparticles as a coolant for the minichannel. Al2O3-water nanofluid and TiO2-water nanofluid were tested for the copper minichannel heat sink, with the bottom of 20 x 20 mm laminar flow as a coolant, through hydraulic diameters. The result showed that adding Al2O3 nanoparticles to water at 4 of volume fractions, enhanced the thermal conductivity by 11.98 and by dispersing TiO2 to the base fluid, was 9.97. It was found that using nanofluid such as Al2O3-water instead of water, improved the cooling by 2.95 to 17.32 and by using TiO2-water, 1.88 to 16.53 was achieved. The highest pumping power by using Al2O3-water and TiO2-water at 4 vol. and 0.1 m/s was 0.000552 W and at 4 vol. and 1.5 m/s was 0.12437 W.
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spelling um.eprints-65652019-10-25T06:26:57Z http://eprints.um.edu.my/6565/ Cooling of minichannel heat sink using nanofluids Ijam, A. Saidur, Rahman Ganesan, P. TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery Nanofluids contain a small fraction of solid nanoparticles in base fluids. Nanofluids cooled small channel heat sinks, have been anticipated to be an excellent heat dissipation method for the next generation electronic devices. In this study, nanofluids are used with different volume fractions of nanoparticles as a coolant for the minichannel. Al2O3-water nanofluid and TiO2-water nanofluid were tested for the copper minichannel heat sink, with the bottom of 20 x 20 mm laminar flow as a coolant, through hydraulic diameters. The result showed that adding Al2O3 nanoparticles to water at 4 of volume fractions, enhanced the thermal conductivity by 11.98 and by dispersing TiO2 to the base fluid, was 9.97. It was found that using nanofluid such as Al2O3-water instead of water, improved the cooling by 2.95 to 17.32 and by using TiO2-water, 1.88 to 16.53 was achieved. The highest pumping power by using Al2O3-water and TiO2-water at 4 vol. and 0.1 m/s was 0.000552 W and at 4 vol. and 1.5 m/s was 0.12437 W. International Communications in Heat and Mass Transfer 2012 Article PeerReviewed Ijam, A. and Saidur, Rahman and Ganesan, P. (2012) Cooling of minichannel heat sink using nanofluids. International Communications in Heat and Mass Transfer, 39 (8). pp. 1188-1194. ISSN 0735-1933, DOI https://doi.org/10.1016/j.icheatmasstransfer.2012.06.022 <https://doi.org/10.1016/j.icheatmasstransfer.2012.06.022>. http://ac.els-cdn.com/S0735193312001492/1-s2.0-S0735193312001492-main.pdf?_tid=5693d76a-4023-11e2-a1c3-00000aacb35f&acdnat=1354853309_aaca28f4d4b7bc44c90ff542140623d2 10.1016/j.icheatmasstransfer.2012.06.022
spellingShingle TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
Ijam, A.
Saidur, Rahman
Ganesan, P.
Cooling of minichannel heat sink using nanofluids
title Cooling of minichannel heat sink using nanofluids
title_full Cooling of minichannel heat sink using nanofluids
title_fullStr Cooling of minichannel heat sink using nanofluids
title_full_unstemmed Cooling of minichannel heat sink using nanofluids
title_short Cooling of minichannel heat sink using nanofluids
title_sort cooling of minichannel heat sink using nanofluids
topic TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
work_keys_str_mv AT ijama coolingofminichannelheatsinkusingnanofluids
AT saidurrahman coolingofminichannelheatsinkusingnanofluids
AT ganesanp coolingofminichannelheatsinkusingnanofluids