The effects of adding silver and indium to lead-free solders
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Format: | Article |
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2009
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author | Dharma, I.G.B. Abd Shukor, Mohd Hamdi Ariga, T. |
author_facet | Dharma, I.G.B. Abd Shukor, Mohd Hamdi Ariga, T. |
author_sort | Dharma, I.G.B. |
collection | UM |
first_indexed | 2024-03-06T05:17:37Z |
format | Article |
id | um.eprints-6973 |
institution | Universiti Malaya |
last_indexed | 2024-03-06T05:17:37Z |
publishDate | 2009 |
record_format | dspace |
spelling | um.eprints-69732021-10-01T03:58:23Z http://eprints.um.edu.my/6973/ The effects of adding silver and indium to lead-free solders Dharma, I.G.B. Abd Shukor, Mohd Hamdi Ariga, T. TS Manufactures 2009 Article PeerReviewed Dharma, I.G.B. and Abd Shukor, Mohd Hamdi and Ariga, T. (2009) The effects of adding silver and indium to lead-free solders. Welding Journal, 88 (4). pp. 45-48. ISSN 0043-2296, |
spellingShingle | TS Manufactures Dharma, I.G.B. Abd Shukor, Mohd Hamdi Ariga, T. The effects of adding silver and indium to lead-free solders |
title | The effects of adding silver and indium to lead-free solders |
title_full | The effects of adding silver and indium to lead-free solders |
title_fullStr | The effects of adding silver and indium to lead-free solders |
title_full_unstemmed | The effects of adding silver and indium to lead-free solders |
title_short | The effects of adding silver and indium to lead-free solders |
title_sort | effects of adding silver and indium to lead free solders |
topic | TS Manufactures |
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