The effects of adding silver and indium to lead-free solders

Bibliographic Details
Main Authors: Dharma, I.G.B., Abd Shukor, Mohd Hamdi, Ariga, T.
Format: Article
Published: 2009
Subjects:
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author Dharma, I.G.B.
Abd Shukor, Mohd Hamdi
Ariga, T.
author_facet Dharma, I.G.B.
Abd Shukor, Mohd Hamdi
Ariga, T.
author_sort Dharma, I.G.B.
collection UM
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institution Universiti Malaya
last_indexed 2024-03-06T05:17:37Z
publishDate 2009
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spelling um.eprints-69732021-10-01T03:58:23Z http://eprints.um.edu.my/6973/ The effects of adding silver and indium to lead-free solders Dharma, I.G.B. Abd Shukor, Mohd Hamdi Ariga, T. TS Manufactures 2009 Article PeerReviewed Dharma, I.G.B. and Abd Shukor, Mohd Hamdi and Ariga, T. (2009) The effects of adding silver and indium to lead-free solders. Welding Journal, 88 (4). pp. 45-48. ISSN 0043-2296,
spellingShingle TS Manufactures
Dharma, I.G.B.
Abd Shukor, Mohd Hamdi
Ariga, T.
The effects of adding silver and indium to lead-free solders
title The effects of adding silver and indium to lead-free solders
title_full The effects of adding silver and indium to lead-free solders
title_fullStr The effects of adding silver and indium to lead-free solders
title_full_unstemmed The effects of adding silver and indium to lead-free solders
title_short The effects of adding silver and indium to lead-free solders
title_sort effects of adding silver and indium to lead free solders
topic TS Manufactures
work_keys_str_mv AT dharmaigb theeffectsofaddingsilverandindiumtoleadfreesolders
AT abdshukormohdhamdi theeffectsofaddingsilverandindiumtoleadfreesolders
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