Study of melting of low temperature metal for fused filament fabrication (fff) process
This project paper is about the adhesion of 2 dissimilar materials. The materials involved are metal and polymer. The concept is based on printing of solder track on Fused Filament Fabrication (FFF) printed model. The objective of this project is to construct an extruder suitable for the deposition...
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| Format: | Academic Exercise |
| Language: | English English |
| Published: |
2022
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| Subjects: | |
| Online Access: | https://eprints.ums.edu.my/id/eprint/34375/1/24PAGES.pdf https://eprints.ums.edu.my/id/eprint/34375/2/FULLTEXT.pdf |
| _version_ | 1825715043010871296 |
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| author | Ong Tun Yau |
| author_facet | Ong Tun Yau |
| author_sort | Ong Tun Yau |
| collection | UMS |
| description | This project paper is about the adhesion of 2 dissimilar materials. The materials involved are metal and polymer. The concept is based on printing of solder track on Fused Filament Fabrication (FFF) printed model. The objective of this project is to construct an extruder suitable for the deposition of conductive materials on thermoplastic substrates fabricated by FFF process. Therefore, a prototype is constructed to carry out soldering to represent the metal printing process. The next objective is to investigate the optimum printing speed for the deposition and adhesion on the printed surface fabricated by FFF process. Thus, three printing speeds are calculated by adjusting the input pulse frequency of stepper motors and the optimum speed will be selected. Other than this, effect of surface conditions of thermoplastic substrates fabricated by FFF process on adhesion of conductive materials is investigated. Three printed substrates are surface treated with sandpaper, ironing and copper spray respectively to achieve this objective. From the results, the pattern of solder tracks for each printing speed is almost the same but the number of deposited solder beads and distance between successive beads are different. The slowest printing speed is chosen for the printing of solder tracks on surface treated substrate and the results show almost the same, indicating the insignificance of printing speed and surface condition on the adhesion of solder and PLA. |
| first_indexed | 2024-03-06T03:20:46Z |
| format | Academic Exercise |
| id | ums.eprints-34375 |
| institution | Universiti Malaysia Sabah |
| language | English English |
| last_indexed | 2024-03-06T03:20:46Z |
| publishDate | 2022 |
| record_format | dspace |
| spelling | ums.eprints-343752022-10-11T03:59:13Z https://eprints.ums.edu.my/id/eprint/34375/ Study of melting of low temperature metal for fused filament fabrication (fff) process Ong Tun Yau TS200-770 Metal manufactures. Metalworking This project paper is about the adhesion of 2 dissimilar materials. The materials involved are metal and polymer. The concept is based on printing of solder track on Fused Filament Fabrication (FFF) printed model. The objective of this project is to construct an extruder suitable for the deposition of conductive materials on thermoplastic substrates fabricated by FFF process. Therefore, a prototype is constructed to carry out soldering to represent the metal printing process. The next objective is to investigate the optimum printing speed for the deposition and adhesion on the printed surface fabricated by FFF process. Thus, three printing speeds are calculated by adjusting the input pulse frequency of stepper motors and the optimum speed will be selected. Other than this, effect of surface conditions of thermoplastic substrates fabricated by FFF process on adhesion of conductive materials is investigated. Three printed substrates are surface treated with sandpaper, ironing and copper spray respectively to achieve this objective. From the results, the pattern of solder tracks for each printing speed is almost the same but the number of deposited solder beads and distance between successive beads are different. The slowest printing speed is chosen for the printing of solder tracks on surface treated substrate and the results show almost the same, indicating the insignificance of printing speed and surface condition on the adhesion of solder and PLA. 2022 Academic Exercise NonPeerReviewed text en https://eprints.ums.edu.my/id/eprint/34375/1/24PAGES.pdf text en https://eprints.ums.edu.my/id/eprint/34375/2/FULLTEXT.pdf Ong Tun Yau (2022) Study of melting of low temperature metal for fused filament fabrication (fff) process. Universiti Malaysia Sabah. (Unpublished) |
| spellingShingle | TS200-770 Metal manufactures. Metalworking Ong Tun Yau Study of melting of low temperature metal for fused filament fabrication (fff) process |
| title | Study of melting of low temperature metal for fused filament fabrication (fff) process |
| title_full | Study of melting of low temperature metal for fused filament fabrication (fff) process |
| title_fullStr | Study of melting of low temperature metal for fused filament fabrication (fff) process |
| title_full_unstemmed | Study of melting of low temperature metal for fused filament fabrication (fff) process |
| title_short | Study of melting of low temperature metal for fused filament fabrication (fff) process |
| title_sort | study of melting of low temperature metal for fused filament fabrication fff process |
| topic | TS200-770 Metal manufactures. Metalworking |
| url | https://eprints.ums.edu.my/id/eprint/34375/1/24PAGES.pdf https://eprints.ums.edu.my/id/eprint/34375/2/FULLTEXT.pdf |
| work_keys_str_mv | AT ongtunyau studyofmeltingoflowtemperaturemetalforfusedfilamentfabricationfffprocess |