Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT;...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Published: |
Springer Nature
2022
|
| _version_ | 1825938620112961536 |
|---|---|
| author | Dele-Afolabi, Temitope T. Hanim, M. A. Azmah Vidyatharran, K. Amin Matori, Khamirul Amin O. Saliza, Azlina Recep, Çalin |
| author_facet | Dele-Afolabi, Temitope T. Hanim, M. A. Azmah Vidyatharran, K. Amin Matori, Khamirul Amin O. Saliza, Azlina Recep, Çalin |
| author_sort | Dele-Afolabi, Temitope T. |
| collection | UPM |
| description | The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05 and 0.1 wt%) were successfully synthesized through the powder metallurgy route and afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas, the Ni3Sn4 IMC and (Cu,Ni)6Sn5 IMC appeared at the SAC solder/ENIAg substrate interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain counterparts for both substrates used. Given the prospects of the ENIAg as a reliable surface finish material, the SAC-xCNT/ENIAg exhibited IMC thickness values within the range of 2.98–2.65 µm as compared to the 5.23–3.61 µm demonstrated by the SAC-xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibiting the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively. |
| first_indexed | 2024-04-09T03:50:27Z |
| format | Article |
| id | upm.eprints-101956 |
| institution | Universiti Putra Malaysia |
| last_indexed | 2024-04-09T03:50:27Z |
| publishDate | 2022 |
| publisher | Springer Nature |
| record_format | dspace |
| spelling | upm.eprints-1019562024-03-15T04:06:33Z http://psasir.upm.edu.my/id/eprint/101956/ Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish Dele-Afolabi, Temitope T. Hanim, M. A. Azmah Vidyatharran, K. Amin Matori, Khamirul Amin O. Saliza, Azlina Recep, Çalin The combined effect of MWCNTs (multi-walled carbon nanotubes) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of interfacial microstructure and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder was investigated in this study. Plain and composite solders (SAC-xCNT; x = 0, 0.01, 0.05 and 0.1 wt%) were successfully synthesized through the powder metallurgy route and afterwards soldered on the ENIAg surface finish and plain Cu substrates. Detailed analysis of the microstructure revealed the formation of the Cu6Sn5 IMC at the SAC solder/Cu substrate interface of the SAC-xCNT/Cu solder interconnects. Whereas, the Ni3Sn4 IMC and (Cu,Ni)6Sn5 IMC appeared at the SAC solder/ENIAg substrate interface of the SAC-xCNT/ENIAg. The MWCNTs-reinforced SAC composite solder interconnects exhibited thinner interfacial IMC layer thicknesses relative to the plain counterparts for both substrates used. Given the prospects of the ENIAg as a reliable surface finish material, the SAC-xCNT/ENIAg exhibited IMC thickness values within the range of 2.98–2.65 µm as compared to the 5.23–3.61 µm demonstrated by the SAC-xCNT/Cu. Overall, the strengthening capacity of the MWCNTs was well-defined in both sample grades, with the SAC-0.05CNT/Cu and SAC-0.05CNT/ENIAg exhibiting the highest shear strength values of 10.23 MPa and 11.14 MPa, respectively. Springer Nature 2022-04 Article PeerReviewed Dele-Afolabi, Temitope T. and Hanim, M. A. Azmah and Vidyatharran, K. and Amin Matori, Khamirul Amin and O. Saliza, Azlina and Recep, Çalin (2022) Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. Journal of Materials Science: Materials in Electronics, 33 (10). 8233 - 8246. ISSN 0957-4522; ESSN: 1573-482X https://link.springer.com/article/10.1007/s10854-022-07974-8 10.1007/s10854-022-07974-8 |
| spellingShingle | Dele-Afolabi, Temitope T. Hanim, M. A. Azmah Vidyatharran, K. Amin Matori, Khamirul Amin O. Saliza, Azlina Recep, Çalin Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish |
| title | Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish |
| title_full | Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish |
| title_fullStr | Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish |
| title_full_unstemmed | Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish |
| title_short | Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish |
| title_sort | interfacial microstructure evolution and shear strength of mwcnts reinforced sn 1 0ag 0 5cu sac105 composite solder interconnects on plain cu and eniag surface finish |
| work_keys_str_mv | AT deleafolabitemitopet interfacialmicrostructureevolutionandshearstrengthofmwcntsreinforcedsn10ag05cusac105compositesolderinterconnectsonplaincuandeniagsurfacefinish AT hanimmaazmah interfacialmicrostructureevolutionandshearstrengthofmwcntsreinforcedsn10ag05cusac105compositesolderinterconnectsonplaincuandeniagsurfacefinish AT vidyatharrank interfacialmicrostructureevolutionandshearstrengthofmwcntsreinforcedsn10ag05cusac105compositesolderinterconnectsonplaincuandeniagsurfacefinish AT aminmatorikhamirulamin interfacialmicrostructureevolutionandshearstrengthofmwcntsreinforcedsn10ag05cusac105compositesolderinterconnectsonplaincuandeniagsurfacefinish AT osalizaazlina interfacialmicrostructureevolutionandshearstrengthofmwcntsreinforcedsn10ag05cusac105compositesolderinterconnectsonplaincuandeniagsurfacefinish AT recepcalin interfacialmicrostructureevolutionandshearstrengthofmwcntsreinforcedsn10ag05cusac105compositesolderinterconnectsonplaincuandeniagsurfacefinish |