Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations
New formulations are produced for problems associated with multiple cracks in the upper part of thermoelectric-bonded materials subjected to remote stress using hypersingular integral equations (HSIEs). The modified complex stress potential function method with the continuity conditions of the resul...
| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Multidisciplinary Digital Publishing Institute
2023
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