Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.

NiFe film was pulse electrodeposited on conductive Cu substrate under galvanostatic mode in the presence of an ultrasonic field. The NiFe film electrodeposited was subjected to structural and surface analyses by X-ray diffraction, energy dispersive X-ray spectroscopy, surface profiling and scanning...

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Main Authors: Balachandran, R., Yow, H. K., Ong, Boon Hoong, Manickam, R., Saaminathan, V., Tan, Kar Ban
Format: Article
Language:English
English
Published: Elsevier 2009
Online Access:http://psasir.upm.edu.my/id/eprint/14424/1/Effects%20of%20ultrasonic%20field%20in%20pulse%20electrodeposition%20of%20NiFe%20film%20on%20Cu%20substrate.pdf
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author Balachandran, R.
Yow, H. K.
Ong, Boon Hoong
Manickam, R.
Saaminathan, V.
Tan, Kar Ban
author_facet Balachandran, R.
Yow, H. K.
Ong, Boon Hoong
Manickam, R.
Saaminathan, V.
Tan, Kar Ban
author_sort Balachandran, R.
collection UPM
description NiFe film was pulse electrodeposited on conductive Cu substrate under galvanostatic mode in the presence of an ultrasonic field. The NiFe film electrodeposited was subjected to structural and surface analyses by X-ray diffraction, energy dispersive X-ray spectroscopy, surface profiling and scanning electron microscopy, respectively. The results show that the ultrasonic field has significantly improved the surface roughness, reduced the spherical grain size in the range from 490–575 nm to 90–150 nm, and increased the Ni content from 76.08% to 79.74% in the NiFe film electrodeposited.
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spelling upm.eprints-144242015-09-02T02:21:09Z http://psasir.upm.edu.my/id/eprint/14424/ Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate. Balachandran, R. Yow, H. K. Ong, Boon Hoong Manickam, R. Saaminathan, V. Tan, Kar Ban NiFe film was pulse electrodeposited on conductive Cu substrate under galvanostatic mode in the presence of an ultrasonic field. The NiFe film electrodeposited was subjected to structural and surface analyses by X-ray diffraction, energy dispersive X-ray spectroscopy, surface profiling and scanning electron microscopy, respectively. The results show that the ultrasonic field has significantly improved the surface roughness, reduced the spherical grain size in the range from 490–575 nm to 90–150 nm, and increased the Ni content from 76.08% to 79.74% in the NiFe film electrodeposited. Elsevier 2009-07-29 Article PeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/14424/1/Effects%20of%20ultrasonic%20field%20in%20pulse%20electrodeposition%20of%20NiFe%20film%20on%20Cu%20substrate.pdf Balachandran, R. and Yow, H. K. and Ong, Boon Hoong and Manickam, R. and Saaminathan, V. and Tan, Kar Ban (2009) Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate. Journal of Alloys and Compounds, 481 (1-2). pp. 336-339. ISSN 0925-8388; ESSN: 1873-4669 10.1016/j.jallcom.2009.02.129 English
spellingShingle Balachandran, R.
Yow, H. K.
Ong, Boon Hoong
Manickam, R.
Saaminathan, V.
Tan, Kar Ban
Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.
title Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.
title_full Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.
title_fullStr Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.
title_full_unstemmed Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.
title_short Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.
title_sort effects of ultrasonic field in pulse electrodeposition of nife film on cu substrate
url http://psasir.upm.edu.my/id/eprint/14424/1/Effects%20of%20ultrasonic%20field%20in%20pulse%20electrodeposition%20of%20NiFe%20film%20on%20Cu%20substrate.pdf
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