Design and fabrication technique of thick-film circuits
This paper describes the stages in the design and fabrication of a hybrid circuit in thick-film technology. The material commonly used for thick-film circuit fabriation are also described. The use of CAD package greatly reduces the time required to develope the hybrid circuits.
| Autors principals: | , , |
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| Format: | Conference or Workshop Item |
| Idioma: | English |
| Publicat: |
1990
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| Accés en línia: | http://psasir.upm.edu.my/id/eprint/18064/1/ID%2018064.pdf |